2024年11月18-21日，第十届国际第三代半导体论坛（IFWS2024）&第二十一届中国国际半导体照明论坛（SSLCHINA2024）、先进半导体技术应用创新展（CASTAS）将在苏州国际博览中心G馆举办。合美半导体（北京）有限公司诚邀第三代半导体产业同仁共聚论坛。
公司简介
合美半导体（北京）有限公司成立于北京。自成立以来一直致力于化合物半导体材料精密研磨和抛光机台研制以及前沿工艺的开发，产品广泛引用于红外材料，第三代半导体材料，氧化稼，单晶/多晶金刚石，多晶碳化硅，光纤，铌酸锂，碳酸锂等材料的高精度研磨和抛光。国内主要用户多为知名研究院所、大学及上市企业，以技术的先进性及设备的可靠性获得了业内的一致好评！同时与知名大学共建联合实验室，共享国际最前沿的研磨抛光工艺。
Homewell Semiconductor (Beijing) Co., Ltd. was established in Beijing. Since its establishment, it has been dedicated to the development of precision Lapping and Polishing Equipment for compound semiconductors and advanced process development. Our products are widely used in High-precision lapping and polishing of Infrared Materials, third-generation semiconductor materials, Ga₂O₃, C, PKD, polycrystalline SiC, FIBRE, LiNbO₃, Li₂CO₃, etc. for High-precision Lapping and Polishing.
Most of domestic users are well-known research institutes, universities, and listed companies, and we have gained consistent from the industry for its technological advancement and equipment reliability! Meanwhile, we have established a joint laboratory with renowned university, sharing the most advanced lapping and polishing processes.
参会联系
