2024年11月18-21日，第十届国际第三代半导体论坛（IFWS2024）&第二十一届中国国际半导体照明论坛（SSLCHINA2024）、先进半导体技术应用创新展（CASTAS）将在苏州国际博览中心举办。
北京特思迪半导体设备有限公司将携多款产品亮相此次展会。值此，诚挚邀请第三代半导体产业同仁共聚论坛，莅临B15号展位参观交流、洽谈合作。
关于特思迪
北京特思迪半导体设备有限公司是一家拥有自主知识产权的国家高新技术企业，专注于半导体领域超精密平面加工设备的研发、生产和销售。以“引领半导体技术进步，助力客户发展”为使命，致力于成为全球技术领先的半导体设备制造企业。
Beijing TSD Semiconductor Equipment Co., it is a national high-tech enterprise with independent intellectual property rights, focusing on R&D, production and sales of ultra-precision plane processing equipment in the semiconductor field. With the mission of "Leading the Progress of Semiconductor Technology, Assisting Customers to Develop ", we are committed to become a global leading technology manufacturer of semiconductor equipment.
公司多次承担国家级、省级重大技术攻关项目，获评国家专精特新“小巨人”企业，国家高新技术企业、中国（潜在）独角兽企业等荣誉称号。研发实力强劲，目前成立了朗途实验室 & 砺晶实验室，分别实现核心部件的自主研发与突破，以及设备+工艺的整体解决方案。
The company has undertaken numerous national and provincial major technological R&D projects, and has been awarded the title of National Specialized, Specialized and Innovative "Small Giant" Enterprise, National High-tech Enterprise, and China (Potential) Unicorn Enterprise, among others. Its R&D strength is strong, and it has established the Laboratory and Lijing Laboratory, which respectively realize the independent R&D and breakthrough of core components, as well as the overall solution of equipment and processes.
产品介绍
特思迪成立以来，深耕半导体领域超精密平面加工设备的研发、生产和销售，形成了技术领先、性能优越、工艺稳定的核心技术优势。先后成功发布多款拥有自主知识产权的多片式单/双面抛光机、单片式抛光机、全自动双轴减薄机、全自动化学机械抛光机等设备，工艺指标均达到国际领先水平，获得头部企业规模化订单。成为国内为数不多可为客户提供减薄、抛光、CMP的系统解决方案和工艺设备整线输出的半导体设备公司。
Since its establishment, TSD has been deeply engaged in the research and development, production and sales of ultra-precision surface machining equipment in the semiconductor field, forming the core technical advantages of leading technology, superior performance and stable process. Has successfully released a number of independent intellectual property rights of multi-chip single/double-sided polishing machine, single-chip polishing machine, automatic dual-axis grinding machine, automatic chemical mechanical polishing machine and other equipment, the process indicators have reached the international leading level, obtained many the head enterprise scale orders. Become one of the few semiconductor equipment companies in China that can provide customers with system solutions for grinding, polishing, CMP and the entire line output of process equipment.
公司产品体系分为衬底抛光、晶圆平坦化、晶圆薄化三大类。减薄、抛光和CMP都属于半导体材料超精密平面加工技术，是半导体制造不可或缺的环节，广泛应用于半导体衬底、晶圆制造、半导体器件、先进封装等多个半导体制造环节。
The company's product system is divided into three categories: substrate polishing, Wafer planarization. Grinding, polishing and CMP are all ultra-precision planar machining technologies of semiconductor materials, which are indispensable links in semiconductor manufacturing and are widely used in semiconductor substrates, wafer manufacturing, semiconductor devices, advanced packaging and other semiconductor manufacturing links.
参会联系
今年，第十届国际第三代半导体论坛&第二十一届中国国际半导体照明论坛（IFWS＆SSLCHINA2024）将于11月18-21日在苏州国际博览中心举办，国内外院士专家齐聚，数十场会议活动，数百位报告嘉宾，全产业链知名企业参与&参展，内容全面覆盖行业工艺装备、原材料、技术、产品与应用各环节，融合聚集产、学、研、用、政、金多个层面的资源，年度国际第三代半导体产业“风向标”盛会，11月相聚苏州，共襄盛会，共谋发展！欢迎业界同仁咨询参展参会，免费观展交流合作！》》》最新60+报告嘉宾公布！IFWS&SSLCHINA2024报名中！
